Το παρακάτω απόσπασμα δίνει λεπτομέρειες ως προς το πως θα εφαρμοστεί η εν λόγω τεχνική.
“When the heat generation amount of the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance possessed by the grease. In the semiconductor device…a metal liquefied by heat at the time of operation of a semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator in place of grease. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improve.
In a structure using a metal having fluidity as a heat conductive material, in order to sufficiently exhibit cooling performance, it is important to limit a range in which the heat conductive material spreads even when a posture change or vibration of the semiconductor device occurs. Furthermore, when the heat sink is pressed against the semiconductor chip, it is important that the force acts sufficiently on the semiconductor chip. That is, adhesion between the semiconductor chip and the radiator is also important”.
Βεβαίως, αυτό δεν σημαίνει ότι η πατέντα θα εφαρμοστεί οπωσδήποτε στο PlayStation 5 και επιπλέον, δεν αντικαθιστά τις παραδοσιακές τεχνικές ψύξης αλλά τη θερμική πάστα.
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